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						SK Hynix convertible bond 
						proposal clouds prospects for Toshiba chip deal 
						
		 
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		 [July 03, 2017] 
		By Se Young Lee and Kentaro Hamada 
		 
		SEOUL/TOKYO (Reuters) - SK Hynix Inc has 
		proposed that its financing for a consortium picked as preferred bidder 
		for Toshiba Corp's chip unit be done via convertible bonds, two sources 
		said, providing it with a path towards an equity interest in the world's 
		No.2 NAND chip maker. 
		 
		But such an arrangement would fly in the face of Toshiba's assertions 
		that its South Korean rival will have no equity or management influence 
		in the $18 billion chip unit - a stance it has taken to satisfy a 
		government that wants the business to remain under domestic control and 
		for key technology to be kept out of the hands of foreign rivals. 
		 
		The potential for SK Hynix to hold equity would also only harden already 
		trenchant opposition from Western Digital, Toshiba's chip business 
		partner, which is claiming breach of contract and seeking to an 
		injunction to prevent any deal that does not have its consent. 
						
		
		  
						
		The South Korean chipmaker is part of a Japan government-led consortium 
		that also includes Bain Capital and which was hastily cobbled together 
		last month by Japan's trade ministry. While it has the government's 
		implicit stamp of approval, the unusual structure of the offer has 
		raised questions over whether can feasibly clinch a deal. 
		 
		"New details coming out through the media such as the convertible bonds 
		suggest there may be some flaws in the scheme. Toshiba must now explain 
		its exact structure," said Masahiko Ishino, an analyst at Tokai Tokyo 
		Research Center. 
		 
		"Reaching a deal is now looking difficult," he added. 
		 
		Sources familiar with the matter have said a state-backed fund, the 
		Innovation Network Corp of Japan (INCJ), would hold the biggest equity 
		interest despite putting up only 300 billion yen ($2.7 billion) of the 
		planned 2 trillion yen. 
		 
		Bain plans to put up 850 billion yen - half of that amount to be 
		provided by SK Hynix in the form of financing, the sources have said. 
		 
		The South Korean chipmaker plans to buy convertible debt in a special 
		purpose company being created by Bain for the Toshiba acquisition, said 
		one of the sources who spoke on Monday, adding that terms were still 
		being negotiated. 
						
		
		  
						
		
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			Employees walk past identification systems bearing the logos of SK 
			Hynix at its headquarters in Seongnam, South Korea, April 25, 2016. 
			REUTERS/Kim Hong-Ji/File Photo 
            
			  
SK Hynix was unlikely to convert the debt into equity in the near term, the 
source said. 
 
SK Hynix declined to comment while representatives for Bain could not be 
immediately reached for comment. A Toshiba spokesman said the company cannot 
comment on the specifics of the deal. The sources declined to be identified as 
the talks were confidential. 
 
Toshiba is scrambling to get a deal done as fast as possible as it needs funds 
to cover billions in cost overruns at now-bankrupt unit Westinghouse. 
 
But last week, the Japanese conglomerate missed a self-imposed deadline of 
having a signed agreement for the chip business in hand, saying more time was 
needed to smooth out opinions between members of the preferred bidder 
consortium. 
Officials within Toshiba's board and INCJ are also concerned about the potential 
for technology leaks and are demanding the final contract specify that the South 
Korean firm's financing will never be translated into equity, separate sources 
have said. 
 
SK Hynix has only briefly explained its rationale for being part of the 
consortium, saying that it sees further business opportunities with Toshiba. It 
is relatively weak in NAND memory chips although it is the world's No. 2 maker 
of DRAM chips, which help electronic devices multitask. 
  
Toshiba said separately it had made a filing outlining its arguments to Western 
Digital's request for a preliminary injunction to block the sale of the chip 
business sale. A hearing on the issue is scheduled for July 14 and Western 
Digital has said it believes a decision will come on the same day. 
 
(Reporting by Se Young Lee and Kentaro Hamada; Additional reporting by Makiko 
Yamazaki and Junko Fujita in Tokyo and Joyce Lee in Seoul; Editing by Edwina 
Gibbs) 
				 
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