Chip wars: How ‘chiplets’ are emerging as a core part of China’s tech
strategy
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[July 13, 2023] By
Jane Lanhee Lee and Eduardo Baptista
(Reuters) - The sale of struggling Silicon Valley startup zGlue’s
patents in 2021 was unremarkable except for one detail: The technology
it owned, designed to cut the time and cost for making chips, showed up
13 months later in the patent portfolio of Chipuller, a startup in
China’s southern tech hub Shenzhen.
Chipuller purchased what is referred to as chiplet technology, a cost
efficient way to package groups of small semiconductors to form one
powerful brain capable of powering everything from data centers to
gadgets at home.
The previously unreported technology transfer coincides with a push for
chiplet technology in China that started about two years ago, according
to a Reuters analysis of hundreds of patents in the U.S. and China and
dozens of Chinese government procurement documents, research papers and
grants, local and central government policy documents and interviews
with Chinese chip executives.
Industry experts say chiplet technology has become even more important
to China since the U.S. barred it from accessing advanced machines and
materials needed to make today’s most cutting edge chips, and now
largely underpins the country’s plans for self-reliance in semiconductor
manufacturing.
"U.S.-China competition is on the same starting line," Chipuller
chairman Yang Meng said about chiplet technology in an interview with
Reuters. "In other (chip technologies) there is a sizeable gap between
China and the United States, Japan, South Korea, Taiwan."
Barely mentioned before 2021, Chinese authorities have highlighted
chiplets more frequently in recent years, according to a Reuters review.
At least 20 policy documents from local to central governments referred
to it as part of a broader strategy to increase China’s capabilities in
“key and cutting-edge technologies”.
"Chiplets have a very special meaning for China given the restrictions
on wafer fabrication equipment," said Charles Shi, a chip analyst for
brokerage Needham. "They can still develop 3D stacking or other chiplet
technology to work around those restrictions. That’s the grand strategy,
and I think it might even work."
Beijing is rapidly exploiting chiplet technology in applications as
diverse as artificial intelligence to self-driving cars, with entities
from tech giant Huawei Technologies to military institutions exploring
its use.
More major investments in the area are on the way, according to a review
of corporate announcements.
CHINA'S CHIPLET ADVANTAGE
Chiplets, or small chips, can be the size of a grain of sand or bigger
than a thumbnail and are brought together in a process called advanced
packaging.
It is a technology the global chip industry has increasingly embraced in
recent years as chip manufacturing costs soar in the race to make
transistors so small they are now measured in the number of atoms.
Bonding chiplets tightly together can help make more powerful systems
without shrinking the transistor size as the multiple chips can work
like one brain.
Apple’s high-end computer lines use chiplet technology, as do Intel and
AMD’s more powerful chips.
About a quarter of the global chip packaging and testing market sits in
China, according to Dongguan Securities.
While some say this gives China an advantage in leveraging chiplet
technology, Chipuller chairman Yang cautioned the proportion of China's
packaging industry that could be considered advanced was "not very big".
Under the right conditions, chiplets that are personalised according to
the needs of the customer can be completed quickly, in "three to four
months, this is the unique advantage China holds," according to Yang.
Needham's Shi said according to import data published by China’s customs
agency, China’s purchase of chip packaging equipment soared to $3.3
billion in 2021 from its previous high of $1.7 billion in 2018, although
last year it fell to $2.3 billion with the chip market downturn.
Since early 2021 research papers on chiplets started surfacing by
researchers of the Chinese military People’s Liberation Army and
universities it runs, and state-run and PLA-affiliated laboratories are
looking to use chips made using domestic chiplet technology according to
six tenders published over the past three years.
Public documents by the government also show millions of dollars worth
of grants to researchers specializing in chiplet technology, while
dozens of smaller companies have sprouted throughout China in recent
years to meet domestic demand for advanced packaging solutions like
chiplets.
[to top of second column] |
Demo chips made with chiplets by Silicon
Valley startup zGlue are seen in this picture taken in Richmond,
California, U.S., July 7, 2023. All of zGlue's patents have ended up
in a new startup in China called Chipuller as zGlue struggled
financially. REUTERS/Carlos Barria
CHIPLETS ON THE TABLE
Against the backdrop of escalating U.S.-China tension, Chinese
company Chipuller acquired 28 patents either owned by zGlue or
invented by people whose names are on zGlue's patents, according to
an analysis using IP management technology firm Anaqua's Acclaim IP
database.
The acquisition was through a two-step transfer, first through
British Virgin Islands-registered North Sea Investment Co Ltd,
according to documents seen by Reuters and confirmed by Yang.
The Committee on Foreign Investment in the United States (CFIUS), a
powerful Treasury-led committee that reviews transactions for
potential threats to U.S. security, did not respond to a Reuters
request for comment about whether such sales would require their
approval.
CFIUS lawyers Laura Black at Akin's Trade Group, Melissa Mannino at
BakerHostetler and Perry Bechky at Berliner Corcoran & Rowe say
patent sales alone would not necessarily give CFIUS authority over
the deal, as it depends whether the assets purchased constitute a
U.S. business.
Representative Mike Gallagher, an influential lawmaker whose select
committee on China has pressed the Biden administration to take
tougher stances on China, told Reuters zGlue's case highlights the
"urgent need to reform CFIUS".
"(People's Republic of China) entities should not be able to act
with impunity to take advantage of distressed U.S. firms to transfer
their IP to China,” he said in an emailed statement.
Chipuller's Yang said zGlue's lawyer communicated with both CFIUS
and the Department of Commerce to ensure the sale to North Sea would
not fall foul of export controls.
These discussions did not include mention of Chipuller or the
possibility of a Chinese entity ending up in possession of the
patents, according to a Chipuller spokesperson.
"Everything was done very transparently and in accordance with
(U.S.) law," Yang said.
Yang said he considered himself a founder of zGlue as he became an
investor in the company in 2015, soon after its formation, and later
became a director and chairman.
CFIUS visited zGlue offices in 2018 to conduct an investigation
because the company's largest non-U.S. investor, Yang, was from
China, the chairman said.
"So we have spent a lot of time communicating with CFIUS," Yang
said, adding that Chipuller currently does not supply any Chinese
military or U.S.-sanctioned entities.
Chipuller isn’t the only firm with chiplet technology.
Huawei, China’s tech and chip design giant that has been put on the
U.S.'s most restricted list, has been actively filing chiplet
patents.
Huawei published over 900 chiplet-related patent applications and
grants last year in China, up from 30 in 2017, according to Anaqua’s
director of analytics solutions Shayne Phillips.
Huawei declined to comment.
Reuters identified over a dozen announcements over the past two
years for new factories or expansions of existing ones from
companies using chiplet technology in manufacturing across China’s
tech sector, representing an investment totalling over 40 billion
yuan.
They include domestic giants TongFu Microelectronics and JCET Group,
as well as fast-growing startups such as Beijing ESWIN Technology
Group, which spent 5.5 billion yuan on a factory for its chiplet-focused
subsidiary that began operating in April.
One article published in May by an outlet run by China’s Ministry of
Industry and Information Technology (MIIT) urged big Chinese tech
firms the use of domestic packaging companies such as TongFu to help
build China's self-sufficiency in computing power.
"Use Chiplet technology to break through the United States' siege of
my country's advanced process chips,” it said.
MIIT did not respond to a request for comment.
Chipuller chairman Yang puts it this way: "Chiplet technology is the
core driving force for the development of the domestic semiconductor
industry,” he said on the company's official WeChat channel. “It is
our mission and duty to bring it back to China."
($1 = 7.2205 Chinese yuan renminbi)
(Reporting by Jane Lanhee Lee and Eduardo Baptista; Additional
reporting by Echo Wang and Stephen Nellis; editing by Kenneth Li,
Brenda Goh and Lincoln Feast.)
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