TSMC wins $6.6 billion US subsidy for Arizona chip production
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[April 08, 2024] By
David Shepardson and Stephanie Kelly
WASHINGTON (Reuters) -The U.S. Commerce Department said on Monday it
would award Taiwan Semiconductor Manufacturing Co's (TSMC) U.S. unit a
$6.6 billion subsidy for advanced semiconductor production in Phoenix,
Arizona and up to $5 billion in low-cost government loans.
TSMC agreed to expand its planned investment by $25 billion to $65
billion and to add a third Arizona fab by 2030, Commerce said in
announcing the preliminary award. The Taiwanese company will produce the
world's most advanced 2 nanometer technology at its second Arizona fab
expected to begin production in 2028, the department said.
"These are the chips that underpin all artificial intelligence, and they
are the chips that are necessary components for the technologies that we
need to underpin our economy, but frankly, a 21st century military and
national security apparatus," Commerce Secretary Gina Raimondo said in a
statement.
TSMC, the world's largest contract chipmaker and a major supplier to
Apple and Nvidia, had previously announced plans to invest $40 billion
in Arizona. TSMC expects to begin high-volume production in its first
U.S. fab there by the first half of 2025, Commerce said.
The $65 billion-plus investment by TSMC is the largest foreign direct
investment in a completely new project in U.S. history, the department
said.
Congress in 2022 approved the Chips and Science Act to boost domestic
semiconductor output with $52.7 billion in research and manufacturing
subsidies. Lawmakers also approved $75 billion in government loan
authority.
TSMC Arizona has also committed to support the development of advanced
packaging capabilities through partners in the U.S. to allow customers
to purchase advanced chips that are made entirely on U.S. soil, the
department said, adding 70% of TSMC customers were U.S. companies.
TSMC CEO C.C. Wei said the company would help U.S. tech firms "unleash
their innovations by increasing capacity for leading-edge technology
through TSMC Arizona."
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A logo of taiwanese chip giant TSMC is seen at southern Taiwan
science park in Tainan, Taiwan December 29, 2022.REUTERS/Ann
Wang/File Photo
Commerce expects the projects will create 6,000 direct manufacturing
jobs and 20,000 construction jobs. The department said 14 direct
TSMC suppliers plan to construct or expand U.S. plants.
At full capacity, TSMC's three fabs in Arizona will manufacture tens
of millions of leading-edge chips in 5G/6G smartphones, autonomous
vehicles, and AI data center servers, the department said.
Through its Arizona fabs, TSMC will support key customers like
Apple, Nvidia, Advanced Micro Devices and Qualcomm "by addressing
their leading-edge capacity demand, mitigating supply chain
concerns, and enabling them to compete effectively in the ongoing
digital transformation era," the department added.
TSMC said in a separate statement that its Arizona factories aim to
achieve a 90% water recycling rate, adding that the company has
started the design phase of building a water reclamation plant with
a goal of achieving "near zero liquid discharge".
Commerce last month announced $8.5 billion in grants and up to $11
billion in loans for Intel to subsidize leading-edge chip production
from the same program.
The department is expected to unveil an award for South Korea's
Samsung Electronics as soon as next week, sources said. Commerce
declined to comment. Samsung did not respond immediately to a
request for comment.
(Reporting by David Shepardson; Additional reporting by Alexandra
Alper, and Ben Blanchard in Taipei; Editing by Jamie Freed, Kirsten
Donovan)
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