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The
forthcoming announcements are aimed at kick-starting
manufacturing of advanced semiconductors that power smartphones,
artificial intelligence and weapons systems, the WSJ reported,
citing industry executives familiar with the negotiations.
The executives expect some announcements to come before U.S.
President Joe Biden's State of the Union address on March 7, the
WSJ report added.
Among the likely recipients of the subsidies, Intel has projects
under way in Arizona, Ohio, New Mexico and Oregon that will cost
more than $43.5 billion, the paper said.
Another likely recipient, Taiwan Semiconductor Manufacturing Co
(TSMC) has two plants under construction near Phoenix for a
total investment of $40 billion. South Korea's Samsung
Electronics, also a contender, has a $17.3 billion project in
Texas.
Micron Technology, Texas Instruments and GlobalFoundries count
among other top contenders, WSJ said citing industry executives.
The U.S. Department of Commerce, Intel, and TSMC did not
immediately respond to Reuters request for comment.
In December last year, U.S. Commerce Secretary Gina Raimondo
said she would make around a dozen funding awards for
semiconductor chips within the next year, including
multi-billion dollar announcements that could drastically
reshape U.S. chip production.
The first award was announced in December, of over $35 million
to a BAE Systems facility in Hampshire to produce chips for
fighter planes, part of a $39 billion "Chips for America"
subsidy program approved by the U.S. Congress in 2022.
(Reporting by Rishabh Jaiswal in Bengaluru, Editing by William
Maclean and Clelia Oziel)
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