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Operations at the facility could begin in 2028, the report said,
citing people familiar with the matter.
SK Hynix is reviewing its plans to set up an advanced chip
packaging investment in the U.S., but has yet to decide, it said
in a statement.
The facility is expected to add 800 to 1,000 new jobs, according
to the report.
SK pledged in 2022 to invest $15 billion in the semiconductor
industry through research and development programs, materials,
and the creation of an advanced packaging and testing facility
in the United States.
This month, the world's second-largest memory chipmaker began
mass production of next-generation high-bandwidth memory (HBM)
chips used in artificial intelligence chipsets, with sources
saying initial shipments will go to Nvidia.
SK Hynix has been the sole supplier of the version currently
used - the HBM3 - to Nvidia which has 80% of the market for AI
chips.
(Reporting by Arsheeya Bajwa in Bengaluru and Joyce Lee in
Seoul; Editing by Sonia Cheema, Sohini Goswami and Louise
Heavens)
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